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Found this one while roll searching. It has an interesting spike on the surface from Lincoln’s vest, up to the bottom of his chin. Would this be considered a die chip?
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That would be a linear plating bubble. -
Blistered Plating (also called plating bubbles): Gas bubbles that form under the copper plating on copper-plated zinc planchets. Gasses or contaminants that get trapped under the plating expand from the resulting heat and pressure during the strike, causing the plating to push up. These bubbles can vary widely in scope and appearance ranging from small scattered bumps to large elongated or “linear” blisters.
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Notorious on the copper plated Lincolns... LPB (Linear Plating Blister/Bubble)!!!Jim
(A.K.A. Elmer Fudd)
Be verwy verwy quiet... I'm hunting coins!!! Good Hunting!!!
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